What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

The concepts of 3D-IC and chiplets have the whole industry excited. It potentially marks the next stage in the evolution of the IP industry, but so far, technical difficulties and cost have curtailed ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...

Nearly every big city reaches a point in its evolution when it runs out of open space and starts building vertically. This enables far more apartments, offices and people per square mile, while ...

The challenge—and opportunity—for the industry is to lower the barriers to adoption of 3D IC design so that its benefits can become available industry-wide and not just the bleeding edge markets. Thus ...

SEOUL, Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its silicon-proven 3D IC packaging ...

Siemens Digital Industries Software has introduced two new solutions to its Electronic Design Automation (EDA) portfolio that address the complexity challenges associated with the design and ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...